difference between qfp and lqfp package
Broadly, with the above-mentioned criteria, all different IC packages can be easily distinguished. Ceramic QFP packages come in two variants, CERQUAD and CQFP: Hereby the leadframe is attached between two ceramic layers of the package. . The common flat pack IC packages are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), STQFP (Small Thin Quad Plastic Flat Package), FQFP (Fine-pitch Quad Flat Package), HQFP (Quad Flat Package with Heat sink), LQFP (Low profile Quad Flat Package), VQFP (Very-small Quad Flat Package), MQFP (Metric Quad Flat Package), BQFP (Bumper quad flat-pack), ETQFP (Exposed thin quad flat-package), PQFN (Power quad flat-pack), PQFP (Plastic quad flat-package), QFJ (Quad Flat J-leaded package), QFN (Quad Flat Non-leaded package), TQFN (Thin-Quad Flat No-Lead Plastic package), DFN (Dual Flat package), QFI (Quad Flat I-leaded package), HVQFN (Heat-sink very-thin quad flat-pack, no-leads), VQFN (Very-thin quad flat, no-lead), WQFN (Very-very-thin quad flat, no-lead), UQFN (Ultra-thin quad flat-pack, no-lead), and ODFN (Optical dual flat, no-lead). QFN is also a lead frame-based package known as a CSP (Chip Scale Package) because it lets you contact and see lead even after assembly. How do I align things in the following tabular environment? This is helpful and easy to understand the article for the beginners! QFP packages provide the same benefit of the metric TQFP packages with 1.4 mm body thickness (less than 1.7mm, but more than 1.2mm), but are thinner and have a standard lead-frame footprint (0.2mm). Quad Flat J-leaded package QFP . Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. What does QFN stand for? The first step of the QFN-PCB assembly process has got to be solder printing. This is one of the most popular package styles. . Expand Post. Redoing the align environment with a specific formatting. This package is a variant of the CERDIP package. interconnect to the exposed pad. The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. Therefore, as a designer, you can visually check to ensure that the pads are appropriately mounted onto your PCB. Mercury (Hg): 0.1% (1000ppm), 3. Very-small Quad Flat Package MQFP. The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. The pin width and spacing are a bit smaller on the larger LQFP packages. The MAP process involves cutting one massive box set into smaller chunks or parts. The common surface-mount small-outline packages are SOP (Small Outline Package), CSOP (Ceramic small-outline package), DSOP (Dual small-outline package), HSOP (Thermally-enhanced small-outline package), SSOP (Shrink Small Outline Package), TSOP (Thin-Small Outline Package), TSSOP (Thin-Shrink Small Outline Package), TVSOP (Thin very-small-outline package), MSOP (Mini/Micro Small Outline Package), HSSOP (Thermally-enhanced shrink small-outline package), HTSSOP (Thermally-enhanced thin shrink small-outline package), QSOP (Quarter Small Outline Package), SOIC (Small Outline Integrated Circuit), mini-SOIC (Mini small-outline integrated circuit), SOICW (Small Outline Integrated Circuit Wide), PSOP (Plastic small-outline package), PSON (Plastic small-outline no-lead package), VSOP (Very-small-outline package), VSSOP (Very-thin shrink small-outline package), SOJ (Small Outline J-leaded package), SON (Small Outline Non-leaded package), VSON (Very-thin Small Outline Non-leaded package), WSON (Very-very-thin small-outline no-lead package), and USON (Very-very-thin small-outline no-lead package). These packages involve the utilization of a mold array process (MAP) for molding purposes. A variety of techniques for interconnecting several chips within a single package have been proposed and researched: Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. Sometimes, an IC socket is used instead of soldering an IC directly to the PCB. Why does this occur? It is one of the most popular variants of the QFN package. Pins are numbered counter-clockwise from the index dot. Quad flat No-lead packages and Quad flat packages are both pretty impressive devices. QFP vs. QFN: QFP Packages QFP is an acronym for Quad Flat Package. Main ceramic package manufacturers are Kyocera, NTK, and offer the full pincount range. The STM8S microcontroller family reference manual (RM0016) refers to devices in this family as medium-density. Most of the vendors and IC suppliers provide a tabulation of IC packages by first classifying the packages by the number of terminal rows (single row, dual row, quad row, grid array, and unpackaged), then further ramify the packages by mounting style (through-hole and surface-mount), terminal shape and terminal dimensions sequentially. It is the ICs that actually made electronics so popular and ubiquitous it is today. However, the distinguishing factors remain the same as mentioned above. Like Liked Unlike. Mike's Electric Stuff: High voltage, vintage electronics etc. QFP pins are usually bent downwards for easier connectivity to the print circuit board. Regular QFP are 2.0 to 3.8 mm thick depending on size. All sorts of circuits analog, digital and mixed-signal, and all types of components passive or active can be integrated into an IC. Typically 1.4 mm thick. QFP typically have 32 to 208 pins placed in a pitch of 0.4 to 1 mm. Typically 1mm thick. The packaging of an IC gets really important when it has to be used on a PCB. These packages are manufactured using plastic. On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which became effective July 1, 2006. If so, you must definitely work with integrated circuits (ICs) components that function accordingly. The leads are vertically arranged along the boundary line of the package, just like SIP but are arranged by mutual folding in zigzag. They are used for mainstream cost sensitive applications. Why zero amount transaction outputs are kept in Bitcoin Core chainstate database? "QFP" redirects here. 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I made PCBs for HT1632c chips, but they retiring QFP package and switching to LQFP. Network resistors also use these packages. We use our own and third-party cookies to personalize content and analyze web traffic. Remember to follow the manufacturers guidelines when soldering to achieve an optimal output. Board Assembly Recommendations (General) Share. Other types are proprietary designations that may be made by only one or two manufacturers. HTQFP48 SOT545-2 Not suitable for wave soldering. The LQFP offers pin counts up to . 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LQFPs have an exposed die pad on the bottom of the package, which is created by an appropriate lead frame down-set. If you update your question with the part it might be possible to help further. QFP The leads on this package extend out from four sides of the package; the leads are either gullwing (L-shaped) or straight. It is the most common through-hole IC package used in circuits, especially hobby projects. All ICs are linear, rectangular, or square in shape. QFP: quad flat package . 1.00mm 0.80mm 0.65mm SSOP LQFP * These packages are compact versions of the SOP and QFP. There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards. But do the two function in a similar manner? And that is all about QFN. PQFP - Plastic Quad Flat Pack. LQFPs help to solve issues, such as increasing board density, die shrink programs, thin end-product profile and portability. STM32F103 microcontrollers use the Cortex-M3 core, with a maximum CPU speed of 72 MHz. The number after QFP indicates the . The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. Finally and most important, it decides how electrical contacts are laid out from the semiconductor device over a PCB. So follow along and let us help you make a wise IC choice with all the facts in place, no more gambles! Board Assembly Recommendations (QFP) Share. A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27mm (or 1/20inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). Spacing between pins can vary. The common quadruple inline packages are QIP/QIL (Quad In-line) and QUIP (ceramic leadless QIP). SOIC package is shorter and narrower than DIP. A QFP is a surface-mounted IC (integrated circuit) package having gull-wing like leads extending on either side of their four edges. QFPs come in two shape variations, rectangular and square: QFP packages have two sections: the top and bottom sections. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. The final step in creating a semiconductor device is integrated circuit packaging, which involves encasing the semiconductor material block (on which a given functional circuit isfabricated) in a protective case to protect it from physical harm and corrosion. Well, this happens due to temperature variation within your reflow oven. The package is a multilayer package, and is offered as HTCC (high temperature co-fired ceramic). In production, is there a significant difference between QFN or TQFP components other than space? The classification of IC packages by different vendors, suppliers, and manufacturers are done in different schemes. TIs latest REACH statement is located on our Environmental information page. The aperture-pad ratio should also be 0.8:1 or within that range for optimum results. Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a, Chip-on-glass (COG), a variation of COB, where a chip, typically a. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. The leads are arranged in two parallel rows along the package length hanging vertically downwards. (The lead pitch and body size are smaller.) Component found on a rework station include: The reworking process takes place as follows. A place where magic is studied and practiced? The LQFP offers pin counts up to 208, and is suitable for designs with high I/Os while meeting low profile requirements. QFPs have small parasitic parameters, and they are also pretty tiny in size. Packages with exposed pads should not be placed opposite to each other on either side of a PCB when doing double-sided mounting. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. Why does this happen? The STM8S105x4/6 access line 8-bit microcontrollers offer from 16 to 32 Kbyte Flash program memory, plus integrated true data EEPROM. There are two-terminal, three-terminal, four-terminal, five-terminal, six-terminal, and more than six-terminal IC packages. In the manufacturing of the QFP packages, three base materials are utilized, namely: In terms of quantity, plastic packages take the lead. Affected: Only used when a REACH SVHC substance(s) is contained above threshold 0.1% REACH Article threshold. This is an even smaller version of the SOIC package. MC9S08AW60CPUE vs MC9S08AW60MPUE Compare result: MC9S08AW60CPUE ,MC9S08AW60MPUE . The TQFP(thin quad flat pack ) is a low-profile version of the regular quad flat package. Copper lead-frames are used in TQFPs. Youtube channel :Taking wierd stuff apart. Then you should automatically know that it is plastic. Package Size (mm) Lead Count LQFP 7 x 7 32, 48, 64 10 x 10 44, 64, 80 14 x 14 64, 80, 100, 120 20 x 20 144, 176 24 x 24 176 28 x 28 208 LQFP-ep 10 x 10 64 These type of QFP packages often have a -EP suffix (e.g. It restricted the following substances at the homogenous (material) level with associated maximum thresholds. These amazingly intricate packages have small balls of solder arranged in a 2D grid on the bottom. This button displays the currently selected search type. The first one is if the component can be used on a prototyping board, PCB, or both. So far, we have more than 4,000 customers worldwide. Free e-zine with select content and advertisements of Electronics For You. Like how the connections are organized in an IC, how they are laid out using a standard IC package must be coherent with the application and various use cases of the respective IC. A square or rectangular array of solder balls on one surface, Thermally-enhanced plastic ball-grid array, Center pin is connected to a large heat-transfer pad, Tapered body, one larger pad denotes terminal 1, One terminal is a large heat-transfer pad. The third way the IC packages can be further classified is their terminal (pin) shape. These packages are hermetic. Hi, I am Hommer Zhao, the founder of WellPCB. These are the following . PQFP packaged chips have pins on all sides, and the total number of pins is generally more than 100, and the distance between the pins is very small, and the pins are also very thin. There are a variety of surface-mount packages including SOP, small-outline transistor (SOT), and QFP available in the market. Packaging terminology Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI's packaging options. Although surface-mount, these devices require specific process for assembly. Square they have the same number of pins on each side as they have the same length. TQFPs lend themselves well when trying to reduce the overall thickness of your PCB so you can make it more portable. My datasheet says TQFP but has no recommended land pattern. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame. They have a standard lead-frame footprint of 2mm. It's quite easy to solder these packages and easy enough to probe the individual pins afterwards when testing also. 172-lead (16x16 mm body size) and 100-lead (10x10 mm body size) MAXQFP's and 172 MAXQFP_EP (exposed pad) for automotive industry are introduced. Splaying IC pins out in all four directions gets you something that might look like a quad flat package (QFP). The terminals are either J-leaded or leadless. Pins are numbered counter-clockwise from the index dot. Thickness from 2 mm up-to 3.8 mm. Do you work with programmable modules, PCBs, or microcomputers? These packages utilize ceramic which improves their quality and also their efficiency. Spacing between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80mm intervals. Then, a punch tool splits the molded cavity. How can we achieve this challenging feat? The IC packaging is all about encasing the semiconductor die and taking out macroscopic electrical contacts for interconnections on a PCB. Package Type Pin Count jc ja Still Air Units 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package. LQFP - Low-profile Quad Flat Pack. Wettable Flanks QFNs have an elevation reflecting solder wetting. E.g. Body Size Range: 5 mm x 5 mm to 20 mm x 20 mm, Available Lead Pitches: 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, 1.0 mm. Get the newsletter delivered to your inbox, with helpful tips on PCB assembly and news from WellPCB. It is suitable for applications where height and weight are critical factor.LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package The leadless surface mount packages may also fall into other categories. The packaging mainly serves three purposes first, it protects the semiconductor circuit from physical impairment or damage. Very-small Quad Flat Package MQFP. Pages: [ 1] Go Up. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time. Cadmium (Cd): 0.01% (100ppm), 5. No: Not compliant to TI Green definition. I'm not sure what the difference is between two, other than L stands for Low. When it comes to QFP, you will see a lot of Low profile Quad Flat Packages (LQFP) and Thin Quad Flat Packages (TQFP). Surface Mount Device Package", "National Semiconductor CERPACK Package Products", "National Semiconductor CQGP Package Products", "National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages", "Conexant Systems, Inc. - Conexant First to Launch DVB-S2 Demodulator and FEC Decoder", "Press Releases - Motorola Mobility, Inc", "Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - Maxim", https://www.nxp.com/docs/en/application-note/AN3846.pdf, "Packaging Technology | National Semiconductor Package Drawings, Part Marking, Package Codes, LLP, micro SMD, Micro-Array", "How Chip-On-Boards are Made - SparkFun Learn", "TSSOP-8 Package Dimensions by Diodes Incorporated", "F Package -- 14-Lead Plastic TSSOP (4.4mm)-- (Reference LTC DWG # 05-08-1650)", "F Package -- 20-Lead Plastic TSSOP (4.4mm) -- (Reference LTC DWG # 05-08-1650)", http://pdfserv.maximintegrated.com/package_dwgs/21-0036.PDF, "Murata's world's Smallest Monolithic Ceramic Capacitor - 0201
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